ISSTT Proceedings

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Electrolytic Deposition Techniques for the Fabrication of Submicron Anodes

Authors:
A. GrĂ¼b, C.I. Lin, H.L. Hartnagel
Abstract:
Small-area anodes of whisker contacted Schottky diodes as well as planar Schottky diodes usually are deposited by electroplating techniques. With shrinking anode areas, the physical structure of the deposited metal becomes increasingly important. Therefore, it is essential to investigate the influence of the deposition parameters on the diode performance in order to be capable of fabricating submicron anodes with improved electrical performance. A comparison of DC- and pulse-plating techniques is presented and the influence of parameters such as deposition temperature, current density, and metal film thickness on the diode IN characteristics is experimentally investigated. It is shown that non-optimized deposition parameters lead to degraded diode performance, especially with small anode diameters. Therefore, the influence of the diode diameter is also taken into account for the optimization of the electrolytic deposition. A number of experiments demonstrate that variations of the plating process especially affect the ideality factor and the series resistance of the diodes.
Categories:
Diodes, Receivers
Year:
1995
Session:
1
Full-text:
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Page Number(s):
54-65